Buy Books Online > Applied optics > Advanced MEMS Packaging
Advanced MEMS Packaging: Book by John H. Lau

Advanced MEMS Packaging

Product Details:    Share this by email:

ISBN: 9780071626231    Publisher: McGraw-Hill Education - Europe Year of publishing: 2009     Format:  Hardback No of Pages: 576        Language: English
A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing...Read more
A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability.
Among the topics explored: Advanced IC and MEMS packaging trends MEMS devices, commercial applications, and markets More than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and handling Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding techniques Actuation mechanisms and integrated micromachining Bubble switch, optical switch, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging
Read less
About the author: John H. Lau
John H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow is a senior engineer in the microsystems, modules, and components laboratory at the Institute of Microelectronics(IME)... Read more
John H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow is a senior engineer in the microsystems, modules, and components laboratory at the Institute of Microelectronics(IME) in Singapore. Cheng Kuo Lee is at the National University of Singapore. C. S. Premachandran is at the Institute of Microelectronics in Singapore. Yu Aibin is at the Institute of Microelectronics in Singapore.
Read less

Other books by John H. Lau

Recommended Books for you - See all

Price: Rs. 12656   Rs.7636
You save: Rs.5020
Vendor : Asian Books Pvt Ltd, Delhi
BUY NOW

FREE SHIPPING | Delivered in 21 working days

(Cash on delivery not available)

Imported Edition

Be assured. 7 days Return & Refund Policy.
Click here

Rs.200 OFF

on purchase of Rs.500 & above

1.Click on Add to Cart & Proceed to Checkout
2.Under payment options, choose
"Redeem Coupon Code/Gift Certificate"
3.Enter Promo Code "SHOP200"
4.Get Rs.200 off, Pay Balance Amount

Valid upto 21st July,13

Rs.200 OFF

on purchase of Rs.500 & above

Terms & Conditions