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RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging

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ISBN: 9781441909831    Publisher: Springer-Verlag New York Inc. Year of publishing: 2009     Format:  Hardback No of Pages: 304        
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency...Read more
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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